1 / 4 www.asb.co.kr march 2009 p lerow tm aln0140wt internally matched lna module the plerow tm aln - series is the compactly designed surface - mount module for the use of the lna with or without the following gain blocks in the infrastructure equipment of the mobile wireless (cdma, gsm, pcs, phs, wcdma, dmb, wlan, wibro, wimax), gps, satellite commun i- cation terminals , catv and so on. it has an exceptional performance of low noise figure, high gain, high oip3, and low bias current. the stability factor is always kept more than unity over the application band in order to ensure its unconditionally stable implementation to the application system environment. the surface - mount module package i ncluding the completed matching circuit and other components necessary just in case allows very simple and convenient implementation onto the system board in mass production level. parameter unit specifications min typ max frequency range mhz 125 155 gain db 24 25 gain flatness db ? 0.2 ? 0.3 noise figure db 0.7 0.75 output ip3 (1) dbm 30 31 s11/s22 (2) db - 12/ - 18 output p1db dbm 20 21 switching time (3) ? sec supply current ma 73 90 supply voltage v 5 impedance ? 50 max. rf input power dbm c.w 23~25 (before fail) package type & size mm surface mount type, 10wx10lx3.8h operating temperature is - 40 ? c to +85 ? c. 1) oip3 is measured with tw o tones at an output power of +4 dbm/tone separated by 1 mhz. 2) s11, s22 (max) is the worst value within the frequency band. 3) switching time means the time that takes for output power to get stabilized to its final level after switching dc voltage from 0 v to v s . pin number function 2 rf in 5 rf out 6 v s other s ground feature s s 21 = 25.2 db@125 mhz = 24.8 db @155 mhz nf of 0.7 db over fr e quency unconditionally stable single 5 v supply high oip3@low current c o u pl er note: 1. the number and size of ground via holes in a circuit board is critical f or thermal rf grounding consider a tions. 2. we recommend that the ground via holes be placed on the bottom of all ground pins for better rf and thermal performance, as shown in the dra w ing at the left side. website: www.asb.co.kr e - mail: sales@asb.co.kr tel: (82) 42 - 528 - 722 3 f ax : (82) 42 - 528 - 7222 more inform a tion c o u pl er c o u pl er c o u pl er c o u p l er (recommended footprint) aln0140wt asb i nc. (top view) (bottom view) ? 0.4 plated thru holes to ground plane plerow (side view) 1 - stage single type description specifications (in pr o duction) typ.@t = 25 ? c, v s = 5 v, freq. = 140 mhz, z o.sys = 50 ohms ou t line drawing (unit: mm) solder stencil area
2 / 4 www.asb.co.kr march 2009 p lerow tm aln0140wt internally matched lna module s - param e ters noise figure oip3 p1db 125~155 mhz +5 v typical performance (measured) s - parameters & k fa c tor
3 / 4 www.asb.co.kr march 2009 p lerow tm aln0140wt internally matched lna module 1. s - parameter 2. oip3, p1db & nf note: tested at room temperature. 1. s - parameter 2. oip3, p1db & nf note: tested at v s = 5 v . 125 mhz 140 mhz 155 mhz s21 (db) s11 (db) s22 (db) s21 (db) g/f (db) s11 (db) s22 (db) s21 (db) s11 (db) s22 (db) 4.50 v 24.99 - 13.31 - 24.17 24.83 0.35 - 13.70 - 25.05 24.64 - 13.89 - 25.74 4.75 v 25.25 - 14.22 - 23.59 25.09 0.36 - 14.60 - 23.97 24.89 - 14.77 - 23.89 5.00 v 25.46 - 14.92 - 22.92 25.30 0.37 - 15.30 - 22.90 25.09 - 15.47 - 22.64 5.25 v 25.62 - 15.4 3 - 22.53 25.44 0.39 - 15.80 - 22.49 25.23 - 15.98 - 22.53 5.50 v 25.72 - 15.81 - 22.90 25.55 0.40 - 16.19 - 22.77 25.32 - 16.35 - 22.74 125 mhz 140 mhz 155 mhz oip3 (dbm) p1db (dbm) nf (db) oip3 (dbm) p1db (dbm) nf (db) oip3 ( dbm) p1db (dbm) nf (db) 4.50 v 30.80 20.20 0.558 30.74 20.00 0.506 30.76 20.16 0.439 4.75 v 31.22 21.06 0.604 31.28 21.02 0.538 31.50 21.19 0.444 5.00 v 31.16 21.80 0.632 31.31 21.83 0.555 31.61 21.81 0.492 5.25 v 30.89 22.37 0.643 31.11 22.39 0.573 31 .57 22.39 0.536 5.50 v 30.86 22.83 0.701 31.06 22.86 0.606 31.60 22.84 0.552 125 mhz 140 mhz 155 mhz s21 (db) s11 (db) s22 (db) s21 (db) g/f (db) s11 (db) s22 (db) s21 (db) s11 (db) s22 (db) - 45 ? c 25.78 - 16.67 - 19.62 25.62 0.34 - 17.38 - 18.70 25.44 - 17.64 - 18.47 - 10 ? c 25.78 - 15.70 - 20.92 25.62 0.35 - 16.41 - 20.07 25.43 - 16.62 - 20.01 25 ? c 25.75 - 14.90 - 22.31 25.60 0.34 - 15.46 - 21.71 25.41 - 15.64 - 21.52 60 ? c 25.64 - 13.88 - 23.21 25.49 0.34 - 14.32 - 23.16 25.30 - 14.53 - 24.17 85 ? c 25.56 - 13.35 - 23.38 25.40 0.34 - 13.76 - 24.31 25.22 - 13.92 - 25.13 125 mhz 140 mhz 155 mhz oip3 (dbm) p1db (dbm) nf (db) oip3 (dbm) p1db (dbm) nf (db) oip3 (dbm) p1db (dbm) nf (db) - 45 ? c 30.00 22.09 0.508 30.18 22.2 0 0.458 32.12 23.23 0.427 - 10 ? c 30.90 22.54 0.625 30.88 22.53 0.560 32.53 23.14 0.514 25 ? c 31.37 22.78 0.680 31.33 22.76 0.640 32.81 22.91 0.593 60 ? c 31.26 22.33 0.823 31.34 22.39 0.770 32.95 22.45 0.716 85 ? c 31.93 22.00 0.900 31.91 22.05 0.837 33. 47 22.09 0.788 rf performance with operating temperature rf performance with voltage change
4 / 4 www.asb.co.kr march 2009 p lerow tm aln0140wt internally matched lna module 1) the tantal or mlc (multi layer ceramic) capacitor is optional and for bypassing the ac noise introduced from the dc supply. the capacitance value may be determined by customer s dc supply status . the c a- pacitor should be placed as close as possible to v s pin and be connected directly to the ground plane for the best electrical performance . 2) dc blocking capacitors are always necessarily placed at the input and output port for allowing only the rf signal to pass and blocking the dc component in the signal. the dc blocking capacitors are inclu d- ed inside the aln module. therefore, c1 & c2 capacitors may not be necessary, but can be added just in case that the customer wants. the value of c1 & c2 is determined by considering the application fr e- quency. application circuit recommended soldering reflow process 20~40 sec 260 ? c 200 ? c 150 ? c 60~180 s ec ramp - up (3 ? c/sec) ramp - down (6 ? c/sec) in out vs size 25x25 mm (for aln - at, bt, t series C 10x10 mm) + - aln out in c1 c2 v s tantal or mlc (multi layer c e ramic) c a pacitor evaluation board layout
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